Electronics Forum: rosin and humidity (Page 6 of 7)

High Relative Humidity and Blistering Issues in Assembly

Electronics Forum | Sun Sep 07 20:51:52 EDT 2014 | natashakt

1. Is the high RH environment consistently at 72% RH and 21.4 degrees Celsius? No, over the past 2 weeks I have recorded the highest at the moment: 67% RH at 22.6 degrees C and lowest (it is Spring not summer yet): 31.9% RH at 19.0 degrees C. Or d

High Relative Humidity and Blistering Issues in Assembly

Electronics Forum | Thu Sep 04 03:26:18 EDT 2014 | eurekadrytech

Hi all: Interesting question you have raised as it concerns the rate of absorption by the board material. I represent http://www.EurekaDrytech.com and could assist in resolving the blistering problems you're facing. First some questions. 1. Is the

High Relative Humidity and Blistering Issues in Assembly

Electronics Forum | Mon Sep 08 21:12:29 EDT 2014 | eurekadrytech

Hello, Manufacturing process with high moisture and humidity environments and long term storage will definitely see pop corning effects once high temperature from soldering and/or re-flow process. The moisture that has been adsorbed is likely the ro

environment Operational deg-C and RH% for Paste Printer

Electronics Forum | Thu Jun 06 15:52:38 EDT 2002 | dason_c

It is normal recommended by the paste supplier. Indium paste claim that it can worked on high temp/RH area. Also, check Aim solder web site and they have a good solder paste handling guideline. Internally, we control our environment not exceed 27C

High Relative Humidity and Blistering Issues in Assembly

Electronics Forum | Thu Aug 21 16:00:31 EDT 2014 | davef

This links to a NPL presentation on moisture removal from PCB http://www.npl.co.uk/upload/pdf/20140318_effect_baking.pdf Consider: * Focusing on preventing moisture contamination of boards, rather than removing moisture * There will be no standard

environment Operational deg-C and RH% for Paste Printer

Electronics Forum | Thu Jun 06 21:35:22 EDT 2002 | ianchan

Hi mates, 1) Firstly, thanks for everyone's reply to this thread. Cheers! 2) Secondly, Hussman69: sure u dun mean that blokes' tie was too tight? musta cut off his blood flow and oxygen?!? 3) Thirdly, we checked with our paste supplier, and they r

High Relative Humidity and Blistering Issues in Assembly

Electronics Forum | Sun Aug 17 19:06:42 EDT 2014 | natashakt

Hi All, I have been looking in to some failures of PCB's in Assembly. After SMT the boards are stored for different periods of time in high humity environment (72% RH and 21.4 degrees Celsius) before being sent to Assembly to be handsoldered/put thr

High Relative Humidity and Blistering Issues in Assembly

Electronics Forum | Mon Aug 18 15:04:25 EDT 2014 | rgduval

Off hand, I can't recall a "formula" for how long boards could sit in a specific RH environment. I've done a couple of quick Google searches, and can find a bunch of information on the dispersion rate of moisture in various PCB materials, but, nothi

Re: Cleaning under, around, and through tight spaces

Electronics Forum | Wed Jan 06 04:51:16 EST 1999 | Earl Moon

| | A question for you all! | | | | Back in the good old days, we didn't always know how clean was clean. Much has changed. Much hasn't. | | | | My question concerns cleaning under, through, and around tight spaces. Way back when, we could not clea

Re: Cleaning under, around, and through tight spaces

Electronics Forum | Tue Oct 12 17:40:01 EDT 1999 | Brian W.

| | | A question for you all! | | | | | | Back in the good old days, we didn't always know how clean was clean. Much has changed. Much hasn't. | | | | | | My question concerns cleaning under, through, and around tight spaces. Way back when, we coul


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